Jennie S. Hwang

Jennie S. Hwang, Ph.D., D.Sc.

Close Menu

Selected Publications




List of  Technology Books

(Sole-Authorship)
  • Jennie S. Hwang, "Implementing Environment-friendly Electronics", McGraw-Hill, New York, January 2005 (ISBN-0071430482)
  • Jennie S. Hwang, "Environment-Friendly Electronics: Lead- Free Technology", Electrochemical Publications, LTD, Great Britain, 31 Chapters, 900 Pages, 2001 (ISBN-0-90-115040-1)
  • Jennie S. Hwang, "Modern Solder Technology for Competitive Electronics Manufacturing", McGraw-Hill, New York, 20 Chapters, 600pages, 1996 (ISBN-0-07-031749-3)
  • Jennie S. Hwang, "IC Ball Grid Array & Fine Pitch Peripheral Interconnections", Electrochemical Publications, LTD, Great Britain, 1995 (ISBN-0-90-115029-0)
  • Jennie S. Hwang, Japanese version of "Solder Paste for Electronic Packaging: Technology & Applications for Surface Mount, Hybrid Circuits, and Component Manufacturing", Alkago Publications, Tokyo, Japan, 1991
  • Jennie S. Hwang, "Electronic Packaging: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1989 (ISBN-0-442-20754-9)


List of  Technology Books

(Co-Authorship)
  • Jennie S. Hwang, Chapter 9, "High Density Electronics and Interconnection Handbook", McGraw-Hill, New York, 2002
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 2002
  • Jennie S. Hwang, Chapter 7, "Electronic Assembly Fabrication", McGraw-Hill, New York, 2001
  • Jennie S. Hwang, Chapter 14, "Handbook of Area Array Packaging Manufacturing & Assembly", McGraw-Hill, New York, 2001
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1999
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1996
  • Jennie S. Hwang, Chapter 5, "Handbook of Fine Pitch Surface Mount Technology", Van Nostrand Reinhold, New York, 1993
  • Jennie S. Hwang, Chapter 2, "Solder Joint Reliability," Van Nostrand Reinhold, New York, 1991
  • Jennie S. Hwang, Chapter 5, "Electronic Packaging and Interconnection Handbook", McGraw-Hill, New York, 1991


Selected List of  Non-Technical Papers and Editorials:


  • "AI: A Prelude to Opportunities, Challenges, and Possibilities," 2023
  • "Pearls of Wisdom," 2023
  • "Cybersecurity- Revisit," 2022
  • "Critical Materials – A Compelling Case – Part 1," 2022
  • "Critical Materials – A Compelling Case – Part 2," 2022
  • "In Search of Wisdom," 2022
  • "Artificial Intelligence: Super-Exciting, Ultra-Competitive!" I-Connect, September, 2018.
  • Professional Development Continuing Education Workbooks: "Emerging Technologies and Manufacturing Technologies for Electronics Industry - a series of topics," from 1988 to current (2018).
  • "New Year Outlook - What Can We Expect in 2018?", I-Connect, February 2018.
  • "Can Acquisitions Bear Fruits?", Corporate Directorship, New York Stock Exchange - Corporate Director Services, November 2017.
  • "The Fourth Industrial Revolution - Intelligent Manufacturing (Industry 4.0)," I-Connect, July 2017.
  • "New Year Outlook - China Factor", I-Connect, January 2016.
  • "2015 - Year-End Review", I-Connect, December, 2015.
  • "The Theory Behind Tin WhiskerPhenomena, Part 1", I-Connect, May 2015.
  • "New Year Outlook - What Can We Expect in 2015?", I-Connect, February 2015.
  • "2014 - Year-End Review", I-Connect, December 2014.
  • "Tin Whiskers- Part 6: Preventive and Mitigating Measures -Strategy and Tactics", I-Connect, September 2014.
  • "Tin Whiskers - Capsulization", I-Connect, July 2014.
  • "Tin Whiskers- Part 5: Impact of Testing Conditions", I-Connect, May 2014.
  • "Tin Whiskers- Part 4: Causes and Contributing Factors", I-Connect, March 2014.
  • "New Year Outlook - What Can We Expect in 2014?", I-Connect, January 2014.
  • "2013 - Year-End Review", I-Connect, December 2013.
  • "Tin Whiskers- Part 3: Concerns and Potential Impact", I-Connect, November 2013.
  • "Tin Whiskers - Phenomena and Observations - Part 2", I-Connect, September 2013.
  • "Cybersecurity - from Boardroom to Factory Floor", I-Connect, July 2013.
  • "Tin Whisker - Clarity First", I-Connect, May 2013.
  • "Conflict Minerals - A Snapshot", I-Connect, March,2013.
  • "New Year Outlook - What Can We Expect in 2013?", I-Connect, January 2013.
  • "SAC System: Re-visit", I-Connect, February 2013.
  • "2012 - Year-End Review", I-Connect, December 2012.
  • "Is Microstructure an Indicator for Good or Not-So-Good Solder Joints - Part 4?", I-Connect, November 2012.
  • "Is Microstructure an Indicator for Good or Not-So-Good Solder Joints - Part 3?", I-Connect, October 2012.
  • "Is Microstructure an Indicator for Good or Not-So-Good Solder Joints - Part 2?", I-Connect, September 2012.
  • "Is Microstructure an Indicator for Good or Not-So-Good Solder Joints - Part 1?", I-Connect, August 2012.
  • "100 Points on Lead-free Performance and Reliability - Part 2", I-Connect, July 2012.
  • "100 Points on Lead-free Performance and Reliability - Part 1", I-Connect, June 2012.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability-6", I-Connect May 2012.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability-5", I-Connect, April 2012.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability-4", I-Connect, March 2012.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability-3", I-Connect, February 2012.
  • "What Can We Expect in 2012?", I-Connect, January 2012.
  • "2011 - Year-end Review", I-Connect, December 2011.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability-2", I-Connect, November 2011.
  • "Reliability of Lead-free System - Grid Array Solder Joint Reliability", I-Connect, October 2011.
  • "Reliability of Lead-free System - Solder Joint Fatigue - The Role of Creep", I-Connect, September 2011.
  • "Reliability of Lead-free System - Solder Joint Fatigue", I-Connect, August 2011.
  • "Lead-free Electronics - Reliability Series - Prelude", I-Connect, July 2011.
  • 'What Can We Expect in 2011?", I-Connect, February 2011.
  • "The World Largest Solar-Powered Sports Stadium", Global Solar Technology (U.K.), January/February 2010.
  • "Renewable Energy - The Role of Corporate America", Global Solar Technology (U.K.), September/October 2009.
  • "Renewable Energy Going Forward", Global Solar Technology (U.K.), July/August 2009.
  • "Renewable Energy in Smart Grid" Global Solar Technology (U.K.), May/June 2009.
  • "Solar Energy - Global Perspectives" International Microelectronics Journal, January 2009.
  • "Solar Energy - 10 Reasons Why Oils Should Not Deter Solar Energy", Global Solar Technology (U.K.), January/February 2009.
  • "Solar Energy - Photovoltaics", Global Solar Technology (U.K.), November/December 2008.
  • "Solar Energy - Sweet Spot", Global Solar Technology (U.K.), September/ October 2008.
  • "Photovoltaics in the Realm of Energy", SMTnet.com August 2008.
  • "Lead-free Reliability for Harsh Environment Electronics - part 1 of 10", SMT, May 2007.
  • "Electronics Industry Going Forward", SMT, January 2008.
  • Contributing author: "The Road to Scientific Success - Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., 2006.
  • "Globalization-Technology, Jobs and Trade", Surface Mount Technology, July 2004.
  • "Reflections on APEX 2004", Surface Mount Technology, May 2004.
  • "Outsourcing or Not and To What Extent", Surface Mount Technology, April 2003.
  • "What Can We Expect from Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003.
  • "What Can We Expect from Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003.
  • "What Can We Expect in 2002-Part 1", Surface Mount Technology, January 2002.
  • "Microelectronics in Brazil", Surface Mount Technology, November 2002.
  • "What Can We Expect in 2002-Part 2", Surface Mount Technology, March 2002.
  • "Reflections from the SMTA International Conference", Surface Mount Technology, December 2001.
  • "International trade and Trade Promotion Authority", Surface Mount Technology, November 2001.
  • "Change and Coping with Change", Surface Mount Technology, October 2001.
  • "The Power of Innovation", SMT Magazine, PennWell Publications, LTD, August 2001.
  • "What Can We Expect in 2001-Part 1 - Welcoming the Digital Economy", Surface Mount Technology, January 2001.
  • "What Can We Expect in 2001-Part 2 - Welcoming the Digital Economy", Surface Mount Technology, February 2001.
  • "What Can We Expect in 2001-Part 3 - Welcoming the Digital Economy", Surface Mount Technology, March 2001.
  • "Leadership Inside and Outside the Industry", Surface Mount Technology, May 2000.
  • "Preparation for the New Millennium", Surface Mount Technology, January 2000, Page 18.
  • "Education, Technology, and the New Workforce", Today's Manager, June-July 1999.
  • "Women in Technology", Today's Manager, August/September 1999.
  • "An Address to Women Engineers", Surface Mount Technology, June 1999.
  • "Asia's Financial Crisis - Another Perspective - Possible Outcomes & Impacts", Surface Mount Technology, October 1998.
  • "Asia's Road to Economic Recovery", Today's Manager, Singapore Institute of Management, Singapore, December 1998.
  • "What Can We Expect in 1999 - Part I", Surface Mount Technology, December 1998.
  • "What Can We Expect in 1999 - Part II", Surface Mount Technology, December 1999.
  • "What Can We Expect in 1999 - Part III", Surface Mount Technology, December 1999.
  • "Education & Engineering Education", SMTA Newsletter, June 1994.
  • "An Address to Women Engineers", Surface Mount Technology, June 1999.
  • "Asia's Financial Crisis - Another Perspective - Possible Outcomes & Impacts", Surface Mount Technology, October 1998.
  • " Advanced Materials & Processes", ASM Int'l, November 1998.
  • "What can We Expect in 1998 - Part I?", Surface Mount Technology, February 1998.
  • "What Can We Expect in 1998 - Part II?", Surface Mount Technology, March 1998.
  • "Reflections of NEPCON-West 98", surface Mount Technology, April 1998.
  • "Asia's Financial Crisis-Another Perspective", Surface Mount Technology, September 1998.
  • "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February 1997.
  • "Electronics Industry in China", Surface Mount Technology, July 1997.
  • "International Inter-Society Information Exchange", Surface Mount Technology, August 1997.
  • "Electronics Industry in China", Surface Mount Technology, July 1997.
  • "International Inter-Society Information Exchange", Surface Mount Technology, August 1997.
  • "Surface Mount Technology - Past, Present and Future", Guest Editorial, Journal of The Microelectronics Society, January 1996.
  • "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October 1996.
  • "Affirmative Action - Principle & Practice", The Plain Dealer, August 1995.
  • "Building Trade and Relations with China", The Plain Dealer, May 1994.
  • "Transition of the Manufacturing Workforce", SMTA Newsletter, March 1994.
  • "Virtual Corporation", SMTA Newsletter, April 1994.
  • "U.S. Foreign Policy vs. The Asia Market", SMTA Newsletter, May 1994.
  • "Is There a Gender Gap:", SMTA Newsletter, August 1994.
  • "Innovation, Leadership & Competitiveness", Surface Mount Technology, May 1993.
  • "Emerging Technologies of Semiconductor Industry", SMTA Newsletter, October 1993.


Professional Advancement Courses/Lectures/Seminar Books:


  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Product Failures and Production Defects" at various location across the country and abroad (organized by IPC, JEDEC, IMAPS, SMTA, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2018 (scheduled).
  • Webinar: "Tin Whisker - All You Should Know," SMTA Professional development Program, May 2018.
  • Webinar: "Solder Joint Voids - All You Should Know," SMTA Professional development Program, March 2018.
  • Invited lecturer: OEMs in-house consultation books, 1982 ' 2018 (present).
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Product Failures and Production Defects," Penang, Malaysia, 2018.
  • Webinar: "The Role of Bi in Electronics - All You Should Know," SMTA Professional development Program, November 2017.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2017.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2016.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2015.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2014.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2013.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2012.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2011.
  • Jennie S. Hwang Lectures, "Environment-friendly Electronics - Reliability and How to Alleviate Failures" at various location across the country and abroad (organized by IPC, JEDEC, SMTA, IMAPS, SMT Hybrid and Packaging (Nuremberg, Germany), etc....) 2010.
  • "High Density IC Packages - PoP and BTC - Material, Process, Reliability" Lecture and Workbook, APEX Conference/Exhibition, 2012.
  • "Preventing Production Defects and Failures (Electronics Manufacturing)" Lecture and Workbook, APEX Conference/Exhibition, 2012.
  • "High Density IC Packages - PoP - Material, Process, Reliability" Lecture and Workbook, National Electronic Packaging Conference / Exhibition, Malaysia, 2011.
  • "High Density IC Packages - BTC - Material, Process, Reliability" Lecture and Workbook, National Electronic Packaging Conference / Exhibition, Malaysia, 2011.
  • "High Density IC Packages - PoP - Material, Process, Reliability" Lecture and Workbook, National Electronic Packaging Conference / Exhibition, Malaysia, 2011.
  • "High Density Packages - BGA - Material, Process, Reliability" Lecture and Workbook, National Electronic Packaging Conference / Exhibition, Malaysia, 2011.
  • "New Developments in SMT manufacturing - Material, Process" Lecture and Workbook, Microelectronics Integration Conference / Exhibition, Germany, 2011.
  • "New Developments in SMT manufacturing - Reliability" Lecture and Workbook, Microelectronics Integration Conference / Exhibition, Germany, 2011.
  • "High Density Packages - BGA - Material, Process, Reliability" Lecture and Workbook, SMTA International Conference / Exhibition 2011.
  • "High Density Packages - BTC - Material, Process, Reliability" Lecture and Workbook, APEX International Conference / Exhibition 2011.
  • "High Density Packages - BTC - Material, Process, Reliability" Lecture and Workbook, SMTA International Conference / Exhibition 2011.
  • "High Density Packages - BGA - Material, Process, Reliability" Lecture and Workbook, SMTA International Conference / Exhibition 2011.
  • "High Density Packages - BTC - Material, Process, Reliability" Lecture and Workbook, APEX International Conference / Exhibition 2011.
  • "High Density Packages - Pop - Material, Process, Reliability" Lecture and Workbook, APEX International Conference / Exhibition 2011.
  • "SMT Electronics Manufacturing - Prevention of Production Defects" Lecture and Workbook, APEX International Conference / Exhibition 2011.
  • "Environment-friendly Lead-Free Electronics - Part 1 - 14" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc....) 2010.
  • "Environment-friendly Lead-Free Electronics-Part 1: Introduction & Technology" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc....) 2008, 2007, 2009.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 2: Component Coating & PCB Surface Finish" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2007, 2008.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 3: Implementation & Production" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 4: Reliability & Manufacturing" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 5: System Compatibility" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 6: The Role Bismuth in Lead-free System" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 7: How to Test & Assess reliability" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 8: Rework & Repair" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 9: Production Defects & Remedies" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 10: Special Topics" Workbook, various and numerous invited (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...)
  • "Electronics Assembly and Interconnections - Selected Topics for NASA", 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics-Part 1: Introduction & Technology" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 2: Component Coating & PCB Surface Finish" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 3: Implementation & Production" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 4: Reliability & Manufacturing" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 5: System Compatibility" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 6: The Role Bismuth in Lead-free System" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 7: How to Test & Assess reliability" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 8: Rework & Repair" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 9: Production Defects & Remedies" Workbook, various and numerous invited (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 10: Special Topics" Workbook, various and numerous invited (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2006.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 1: Introduction & Technology" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 2: Component Coating & PCB Surface Finish" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 3: Implementation & Production" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 4: Reliability & Manufacturing" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 5: System Compatibility" Workbook, various and numerous invited (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Electronics -Part 6: The Role Bismuth in Lead-free System" Workbook, various and numerous invited lectures (organized by Hybrid Microelectronics (Germany), IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon (Japan), IMAPS, etc...) 2005.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 1: Introduction & Technology", various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon, IMAPS, etc...) 2004.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 2: Component Coating & PCB Surface Finish", various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2004.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 4: Reliability & Manufacturing", various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc....) 2004.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 5: System Compatibility "at various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc....) 2004.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 6: The Role Bismuth in Lead-free System" Workbook, various and numerous invited lectures (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc....) 2004.
  • Jennie S. Hwang, "Environment-friendly Lead-Free System-Part 1: Introduction & Technology" at various and numerous conferences (organized by IPC, JEDEC, IEEE, SMTA, NEPCON, InterNepcon, IMAPS, etc...) 1990---2004.
  • "Environment-friendly Lead-Free System-Part 2: Component Coating & PCB Surface Finish" at various and numerous conferences (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 1990 '2004.
  • "Environment-friendly Lead-Free System-Part 3: Implementation & Production" at various and numerous conferences (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2000 '2004.
  • "Environment-friendly Lead-Free System-Part 4: Reliability & Manufacturing" at various and numerous conferences (organized by IPC, JEDEC, IEEE, SMTA, IMAPS, etc...) 2001 '2004.
  • "CSP & Flex Packaging & Assembly", CSP and Flexible Circuit Conference, 2004.
  • "Environment-Friendly Lead-free Electronics", IPC/Soltech International Conference, Brussels, Belgium, June 2003.
  • "Environment-Friendly Lead-free Electronics", Hybrid, SMT and Microelectronics Conference, Nuremberg, Germany, May 2003.
  • "CSP, BGA and Fine Pitch Interconnections", Flexible Circuits Conference, Phoenix, February 2003.
  • "Environment-friendly Lead-Free Technologies for Electronic Packaging & Assembly", JEDEC/IPC 3rd Annual International Conference on Lead-Free Electronic Assemblies and Components, San Jose, California, April 2003.
  • "New & Emerging Technologies for Electronic Packaging & Assembly", System Integration in Micro Electronics Conference, Nuremberg, Germany, 2003.
  • "Environment-friendly Lead-Free Technologies for Electronic Packaging & Assembly", European Conference on Lead-Free Electronic Assemblies and Components, Brussels, Belgium, 2003.
  • "Environment-Friendly Electronics", IPC Conference, San Diego, California, 2002.
  • "New & Emerging Technologies for Electronic Packaging & Assembly", National packaging & Production, Conferences/Exhibition, Boston, 2002.
  • "New & Emerging Technologies for Electronic Packaging & Assembly", National packaging & Production, Conferences/Exhibition, Anaheim, CA, 2002.
  • "New and Emerging Technologies for Electronics", International Microelectronics and Packaging Society, Annual Conference, September, Denver, Colorado, September 2002.
  • "Solder Joint Reliability", International Microelectronics and Packaging Society, Annual Conference, Denver, Colorado, September 2002.
  • "CSP, BGA and Fine Pitch Interconnections and Rework", International Microelectronics Packaging Society-Brazil, Annual Meeting, Campinas, Brazil, August 2002.
  • "Environment-Friendly Electronics Manufacturing", Hong Kong Productivity Council, Hong Kong, March 200.2
  • "New and Emerging Technologies for Optoelectronics", Surface Mount Technology International Conference, Chicago, September 2002.
  • "Environment-friendly Electronics-Lead Free Technology", Surface Mount Technology International Conference, Chicago, September 2002.
  • "Environment-friendly Lead-Free PCB Surface Finish and Coating", Surface Mount Technology International Conference, Chicago, September 2002.
  • "New and Emerging Technologies for optoelectronics", NEPCON, Boston, June 2002.
  • "Printed Circuit Board Surface Finish", IEEE/IPC Conference San Jose, May 2002.
  • "Environment-friendly Electronics-Lead Free Technology", IEEE/IPC Conference San Jose, May 2002.
  • "New and Emerging Technologies for Electronic Packaging and Assembly", San Diego, January 2002.
  • "Environment-friendly Electronics-Lead Free Technology", San Diego, January 2002.
  • "Component Lead Coating and PCB Surface Finish", San Diego, January 2002.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", San Diego, Orlando, October 2001.
  • Lecturer: "New and Emerging Technologies for Electronic Packaging and Assembly", Baltimore, October 2001.
  • Lecturer: "Solder Joint Reliability", Baltimore, October 2001.
  • Lecturer: "New and Emerging Technologies for Electronic Packaging and Assembly", Chicago, September 2001.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", San Diego, Chicago, September 2001.
  • Lecturer: "Emerging Technologies", Boston, June 2001.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Boston, June 2001.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Anaheim, California, IPC, February 2001.
  • Lecturer: "SMT Manufacturing-Issues and Solutions", Anaheim, California, February, IPC, 2001.
  • Lecturer: "CSP, BGA and Fine Pitch Interconnections", Anaheim, California, February 2001.
  • Lecturer: "Environment-Friendly Electronics-Lead Free technology", San Diego, California, January, 2001.
  • Lecturer: "Lead Solderability and PCB Surface Finish", San Diego, California, January 2001.
  • Lecturer: "New and Emerging IC Packaging", San Diego, California, January 2001.
  • Lecturer: "Environment-friendly Electronics-Lead Free technology", Australia, October 2000.
  • Lecturer: "Current Issues-Surface Mount Manufacturing", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 2000.
  • Lecturer: "CSP, BGA and Fine Pitch Peripheral Interconnections", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 2000.
  • Lecturer: "Solder Joint Reliability-Manufacturing Perspectives", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Durham, North Carolina, October 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Singapore, October 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Boston, September 2000.
  • Lecturer: "Electronic Assembly-Solder Joint reliability", Boston, September 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free technology", Chicago, September 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Miami, Florida, September 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Minneapolis, MN, June 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Boston, June 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", Minneapolis, MN, May 2000.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology", New Mexico, April 2000.
  • Lecturer: "Surface Mount Technology-Present and Future", TMS Annual Conference, San Diego, California, 1999.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology, Baltimore, November 1999.
  • Lecturer: "Environment-friendly Electronics-Lead Free Technology, Irving California, September 1999.
  • Lecturer: "Environment-friendly Lead-Free Solder Technology - Year 2000 and Beyond", IPC Works, Minneapolis, Minn., October 1999.
  • Lecturer: "Surface Mount Technology - Year 2000 and Beyond", SMTA, International, San Jose, CA, Se /Electronic Packaging & Assembly - Materials, Processes, and Reliability", September 1999.
  • Lecturer: Surface Mount Technology-Issues and Solutions", Third Surface Mount Technology Convention in Puerto Rico, 1999.
  • Speaker: IPC Conferences, Long Beach, California, 1999.
  • Lecturer: National Electronic Packaging & Production - East Annual Conference, Boston, Mass., 1999.
  • Lecturer: National Electronic Packaging & Production - Philadelphia Annual Conference, Philadelphia, Pa., 1999.
  • Lecturer: "Current Issues-Surface Mount Manufacturing", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1999.
  • Lecturer: "CSP, BGA and Fine Pitch Peripheral Interconnections", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1999.
  • Lecturer: "Solder Joint Reliability-Manufacturing Perspectives", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1999.
  • Lecturer: Chip Scale International Conference, Santa Clara, California, 1999.
  • Lecturer: "CSP, BGA and Fine Pitch Interconnections", IPC Conferences, Long Beach, California, 1998.
  • Lecturer: "CSP, BGA and Fine Pitch Interconnections", IPC Conferences, Providence, Rhode Island, 1998.
  • Lecturer: SMTA Academy-Professional Advancement Program, 1998.
  • Lecturer: "Current Issues-Surface Mount Manufacturing", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1998.
  • Lecturer: "CSP, BGA and Fine Pitch Peripheral Interconnections", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1998.
  • Lecturer: "Solder Joint Reliability-Manufacturing Perspectives", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1998.
  • Lecturer: National Electronic Packaging & Production-Texas, Annual Conference, Dallas, Texas, 1998.
  • Lecturer: National Electronic Packaging & Production - Philadelphia Annual Conference, Philadelphia, Pa., 1998.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1998
  • Lecturer: "SMT Soldering Material, Process & Reliability", Hong Kong University of Science and Technology, Hong Long, 1998
  • Lecturer: Chip Scale International Conference, Santa Clara, 1998.
  • Lecturer: Surface Mount International, Annual Conferences, 1998.
  • Lecturer: National Electronic Packaging & Production-West, Annual
  • Conference, Anaheim, California, 1998.
  • Speaker: IPC Conferences, Long Beach, California, 1997.
  • Lecturer: Second Surface Mount Technology Convention in Puerto Rico, 1997.
  • Lecturer: "Current Issues-Surface Mount Manufacturing", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1997.
  • Lecturer: "CSP, BGA and Fine Pitch Peripheral Interconnections", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1997.
  • Lecturer:"Solder Joint Reliability-Manufacturing Perspectives", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1997.
  • Lecturer: Surface Mount International, Annual Conferences, 1997.
  • Lecturer: SMTA Academy-Professional Advancement Program, 1997.
  • Lecturer: National Electronic Packaging & Production-Texas, Annual Conference, Dallas, Texas, 1997.
  • Lecturer: National Electronic Packaging & Packaging & Production - Philadelphia Annual Conference, Philadelphia, Pa., 1997.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1997.
  • Lecturer: National Electronic Packaging & Production - Philadelphia Annual Conference, Philadelphia, Pa., 1997.
  • Speaker: National Electronic Packaging & Production-East, Annual Conference, Boston, MA., 1996.
  • Speaker: IPC Conferences, Long Beach, California, 1996.
  • Lecturer: SMTA Academy-Professional Advancement Program, 1996.
  • Lecturer: Surface Mount International, Annual Conferences, 1996.
  • Lecturer: "Current Issues-Surface Mount Manufacturing", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1996.
  • Lecturer: "CSP, BGA and Fine Pitch Peripheral Interconnections", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1996.
  • Lecturer: "Solder Joint Reliability-Manufacturing Perspectives", National Electronic Packaging & Production - West, Annual Conference, Anaheim, California, 1996.
  • Lecturer: International Microelectronics and Packaging Society, Annual Conferences, 1996.
  • Lecturer: First, Surface Mount Technology Convention in Puerto Rico, 1996
  • Lecturer: National Electronic Packaging & Production-East, Annual Conference, Boston, 1996.
  • Lecturer: National Electronic Packaging & Production-Texas, Annual Conference, Dallas, Texas, 1996.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conference, Anaheim, California, 1995.
  • Lecturer: National Electronic Packaging & Production-East, Annual Conference, Boston, MA., 1995
  • Speaker: IPC Conferences, Long Beach, California, 1995.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1995.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1995.
  • Lecturer: Surface Mount International, Annual Conferences, 1995.
  • Lecturer: SMTA Academy-Professional Advancement program, 1995.
  • Lecturer: National Electronic Packaging & Production-Southeast, Annual Conference, Florida, 1995.
  • Speaker: Expo SMT, Annual Conferences, San Jose, California, 1995.
  • Lecturer: SMTA Academy-- Professional Advancement program, 1995.
  • Lecturer: Surface Mount International, Annual Conferences, 1994.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conference, Anaheim, California, 1994.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1994.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1994.
  • Speaker: IPC Conferences, Long Beach, California, 1994.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1994.
  • Speaker: IPC Conferences, Long Beach, California, 1993.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1993.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1993.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1993.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1993.
  • Lecturer: SMTA Academy-Professional Advancement program, 1993.
  • Lecturer: Surface Mount International, Annual Conferences, 1993.
  • Lecturer: Surface Mount International, Annual Conferences, 1992.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1992.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1992.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1992.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1992.
  • Lecturer: SMTA Academy-Professional Advancement program, 1992.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1991.
  • Lecturer: Surface Mount International, Annual Conferences, 1991.
  • Lecturer: SMTA Academy-Professional Advancement program, 1991.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1991.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1991.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1991.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1990.
  • Speaker: International Microelectronics Society, Annual Conferences, 1991.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1990.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1990.
  • Lecturer: Surface Mount International, Annual Conferences, 1990.
  • Speaker: International Microelectronics Society, Annual Conferences, 1990.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1990.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1989.
  • Lecturer: "Solder Paste-Technology and Applications", Surface Mount International, Annual Conferences, Los Vegas, 1989.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1989.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1989.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1989.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1989.
  • Speaker: IPC Conferences, San Jose, California, 1989.
  • Speaker: International Microelectronics Society, Annual Conferences, 1989.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1988.
  • Lecturer: "Solder Paste-Technology and Applications", Surface Mount International, Annual Conferences, Los Vegas, 1988.
  • Speaker: International Microelectronics Society, Annual Conferences, 1988.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1988.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1988.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1988.
  • Lecturer: International Microelectronics Society, Annual Conferences, 1988.
  • Speaker: IPC Conferences, San Jose, California, 1988.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1987.
  • Lecturer: "Solder Paste-Technology and Applications", Surface Mount International, Annual Conferences, Los Vegas, 1987.
  • Lecturer: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1987.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1987.
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1987.
  • Lecturer: "Solder Pate technology & Applications", International Microelectronics Society, Annual Conferences, 1987.
  • Speaker: "A Unique Rheology", International Microelectronics Society, Annual Conferences, 1987.
  • Speaker: IPC Conferences, San Jose, California, 1987.
  • Speaker: IPC Conferences, San Jose, California, 1986.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1986
  • Lecturer: "Solder Paste-Technology and Applications", Surface Mount International, Annual Conferences, Los Vegas, 1986
  • Speaker: National Electronic Packaging & Production-East, Annual Conferences, Boston, MA., 1986.
  • Speaker: National Electronic Packaging & Production-West, Annual Conferences, Anaheim, California, 1985.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1985.
  • Invited Lecturer: "Solder Paste-Technology and Applications", Singapore, 1983.
  • Lecturer: "Solder Paste-Technology and Applications", Surface Mount International, Annual Conferences, Los Vegas, 1985.
  • Lecturer: "Surface Mount Technology-issues and solutions", Surface Mount International, Annual Conferences, Los Vegas, 1984.
  • Lecturer: "Solder Paste-Technology and Applications", EIA/IPC, Annual Conferences, 1983.


Selected List of  Technical Papers and Editorials:


  • Jennie S. Hwang, "Diffusion in Quartz-Optical Applications", American Ceramic Society. Journal, 1975.
  • Jennie S. Hwang and Nien -Cheng. Lee, "Unique Rheology of Solder Paste for Surface Mount technology", Int'l Symposium of Hybrid Microelectronics, 1984.
  • Riccardo Vanzetti and Jennie S. Hwang, "Laser/Infrared Signature Feed Back Enhances Interconnection Reliability", Conference Proceedings, NEPCON-West, 1989.
  • Jennie S. Hwang, "Soldering and Solder Paste Prospects", Surface Mount Technology, October, 1989, p. 56.
  • Jennie S. Hwang, "Consideration for Surface Mounting Solder Paste", Conference Proceedings, International Electronic Packaging Society, Annual Symposium, 1987.
  • Jennie S. Hwang, "Complex Concoction", Circuits Manufacturing, December, 1987.
  • Jennie S. Hwang, "Rheology of Solder Paste: Theory and Practice",Technical Proceedings, Expo SMT '88, 1988.
  • Jennie S. Hwang " Validity of Viscosity Measurement", SMART Conference Proceedings, 1988.
  • Jennie S. Hwang, "Solder Joint Reliability", Technical Proceedings, EXPO SMT '88, 1988.
  • Jennie S. Hwang, "Defects and Failure Phenomena of Solder Joints", International Symposium of Hybrid Microelectronics, 1988.
  • Jennie S. Hwang and Richard M Vargas, "Solder Joint Reliability - Can Solder Creep?", Conference Proceedings, International Symposium of Hybrid Microelectronics, 1990.
  • Jennie S. Hwang, "Controlled Atmosphere Soldering - Principle and Practice", Technical Proceedings, NEPCON-West, 1990.
  • Jennie S. Hwang, "No-Clean Soldering and Solder Paste", Circuits Manufacturing, September, 1990, p. 41.
  • Jennie S. Hwang, "The Future of SMT Soldering", Electronic Packaging and Production, November, 1990.
  • Jennie S. Hwang, "New Developments in Fluxing & Fluxes", Electronic Packaging and Production, June, 1991, p. 90.
  • Jennie S. Hwang, George Lucey, Roger Clough, James Marshall "Futuristic Solder--Utopia or Ultimate Performance", Surface Mount Technology, September, 1991, P.40.
  • Roger B. Clough, Rajiv Patel, Jennie S. Hwang and George Lucey, "Preparation and Properties of Reflowed Paste and Bulk Composites ", Proceedings, National Electronic Packaging & Production Conference, 1991, p. 1256.
  • James Marshall, George Lucey and Jennie Hwang, "Composites", Proceedings, IEEE Electronic Component Conference, May, 1991.
  • Jennie S. Hwang, Z. Guo and George Lucey, "Strengthened Solder Materials for Electronic Packaging", Proceedings, Surface Mount International Conference, 1993, p. 662.
  • Jennie S. Hwang, "Screen Printing," Surface Mount Technology, March, 1994, p. 44.
  • Jennie S. Hwang, "Overview of Lead-Free ", Proceedings, Surface Mount International Conference, 1994, p. 405.
  • Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs. Solder Joint Integrity - Part I", Proceedings, NEPCON-West, 1994, p. 1095.
  • Jennie S. Hwang, "Solder Materials Development", SMT, March, 1995.
  • Jennie S. Hwang, "Reflow Soldering", SMT, August, 1998.
  • Jennie S. Hwang, "Solder Materials", SMT, March, 1996.
  • Jennie S. Hwang & Holger Koenigsmann, "New Development in Lead-Free Solders", Proceedings, Surface Mount International SMI Conference, 1997.
  • Jennie S. Hwang & Holger Koenigsmann, "Introduction to Creep & Fatigue in Solder Interconnection", SMT, July, 1997.
  • Jennie S. Hwang and Z. Guo, "Solder Joint Reliability: Reflow Cooling Rate vs Solder Joint Integrity - Part II ", to be published.
  • Jennie S. Hwang and Guo, " Environment-friendly Lead-Free Solders for Electronic Packaging and Assembly," Proceedings, Surface Mount International, 1993, p. 732.
  • Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March, 1995.
  • Jennie S. Hwang, "Soldering--Trends and Predictions", Surface Mount Technology, January, 1994, p.14.
  • Jennie S. Hwang, "Solder Materials: Important Physical Properties", Surface Mount Technology, February, 1994, p. 18
  • Jennie S. Hwang, "Water-clean vs. No-clean", Surface Mount Technology, March, 1994, p. 20.
  • Jennie S. Hwang, "Solder Flaws Place Joint Integrity at Risk", Surface Mount Technology, April, 1994, p. 18.
  • Jennie S. Hwang, "Case Study Assesses No-clean Reliability", Surface Mount Technology, May, 1994 p. 20.
  • Jennie S. Hwang, "Have You Heard of ROSA or PADS", Surface Mount Technology, June, 1994, p. 14.
  • Jennie S. Hwang, "How Does Reflow Profile Affect Solder Joint Integrity", Surface Mount Technology, July, 1994. p. 16.
  • Jennie S. Hwang, "BGA: Soldering Concerns and Defects", Surface Mount Technology, August, 1994, p. 18.
  • Jennie S. Hwang, "Reliability of BGA Interconnections", Surface Mount Technology, September, 1994, p. 14.
  • Jennie S. Hwang, "A BGA Package Menu", Surface Mount Technology, October, 1994, p. 20.
  • Jennie S. Hwang, "The Role of Intermetallics in Interconnections", Surface Mount Technology, November, 1994, p. 14.
  • Jennie S. Hwang, "The Role of Gold in Interconnections", Surface Mount Technology, December, 1994, p. 20.
  • Jennie S. Hwang, "Overview of Lead-Free Solders" proceedings, SMI, 1994, p. 405.
  • Jennie S. Hwang, "Low Cycle Fatigue vs. Thermomechanical Fatigue," Surface Mount Technology, January, 1995.
  • Jennie S. Hwang, "Hybrid of QFP and BGA Architectures", Surface Mount Technology, February, 1995.
  • Jennie S. Hwang, "Determining the Optimum Level of Oxygen for Nitrogen Atmosphere Reflow", Surface Mount Technology, March, 1995.
  • Jennie S. Hwang, "Is Microstructure as Indicator for Good or Not-So-Good Solder Joints", Surface Mount Technology, April 1995.
  • Jennie S. Hwang, "Minimizing Reflow Solder Balling--A Collaborative Efforts", Surface Mount Technology, May 1995.
  • Jennie S. Hwang, "Strengthening Solder Materials", Surface Mount Technology, June 1995
  • Jennie S. Hwang, "Chip-Scale Packaging and Assembly--Burgeoning Innovations", Surface Mount Technology, July 1995.
  • Jennie S. Hwang, "It is a Pleasure When the Principle Works", Surface Mount Technology, August 1995.
  • Jennie S. Hwang, "Factors of Solderability - Surface Mount Component Leads", Surface Mount Technology, September 1995.
  • Jennie S. Hwang, "Printed Circuit Board - Surface Finish", Surface Mount Technology, October 1995.
  • Jennie S. Hwang, "Soldering Standards", Surface Mount Technology, November 1995.
  • Jennie S. Hwang, "Challenges in Modeling for Life Prediction", Surface Mount Technology, December 1995.
  • Jennie S. Hwang, "Surface Mount Technology: 1980's vs. 1990's", Surface Mount Technology, January 1996.
  • Jennie S. Hwang, "Surface Mount Technology - Past, Present and Future", The Journal of Microelectronics and Packaging Society, January/February, 1996.
  • Jennie. S. Hwang, "Another Application Advantage from Solder Paste", Surface Mount Technology, February 1996.
  • Jennie S. Hwang, "Intricacies of Data Interpretation--Art or Science?" Surface Mount Technology, March 1996.
  • Jennie S. Hwang, "Solder Materials", Surface Mount Technology, March 1996.
  • Jennie S. Hwang, "Environmentally Sound Manufacturing", Surface Mount Technology, April 1996.
  • Jennie S. Hwang, "Innovations in Interconnections", Surface Mount Technology, May 1996.
  • Jennie S. Hwang, "Effects of a Reflow Temperature Profile", Surface Mount Technology, June 1996.
  • Jennie S. Hwang, "Optimal Mass Reflow Profile", Surface Mount Technology, July 1996.
  • Jennie S. Hwang, "Practical Considerations to Minimize PBGA Cracks", Surface Mount Technology, August 1996.
  • Jennie S. Hwang, "Voids in Solder Joints", Surface Mount Technology, September 1996.
  • Jennie S. Hwang, "Accelerated Equipment Depreciation - A productivity and Growth Enhancer", Surface Mount Technology, October 1996.
  • Jennie S. Hwang, "Rework and Repair - Facilitators", Surface Mount Technology, November 1996.
  • Jennie S. Hwang, "Polyglycol - A culprit or not?" Surface Mount Technology, December 1996.
  • Jennie S. Hwang, "Solder Fatigue or Creep", Surface Mount Technology, January 1997.
  • Jennie S. Hwang, "What Can We Expect in 1997 - A Forecast", Surface Mount Technology, February 1997.
  • Jennie S. Hwang, "Design and Use of Solder Paste for System Reliability", Surface Mount Technology, March 1997.
  • Jennie S. Hwang, "Reflections from NEPCON West '97", Surface Mount Technology, April 1997.
  • Jennie S. Hwang, "Reflow Profiling - Temperature Measurement", Surface Mount Technology, May 1997.
  • Jennie S. Hwang, Options of Surface Mount IP Packages, Surface Mount Technology, June 1997.
  • Jennie S. Hwang, "Why Lead-Free Solders?" Surface Mount Technology, September 1997.
  • Jennie S. Hwang, "Will Flip Chip or Chip Scale Packages take over?" Surface Mount Technology, October 1997.
  • Jennie S. Hwang, "The Mystery of Chip Scale Packages", Surface Mount Technology, November 1997.
  • Jennie S. Hwang, "Reflections, of 1997", Surface Mount Technology, December, 1997
  • Jennie S. Hwang, "The Solder Beading Phenomenon", Surface Mount Technology, January, 1998
  • Jennie S. Hwang, "What Can We Expect in 1998 - Part I?" Surface Mount Technology, February 1998.
  • Jennie S. Hwang, "What Can We Expect in 1998 - Part II?" Surface Mount Technology, March 1998.
  • Jennie S. Hwang, "Reflections of NEPCON-West '98", Surface Mount Technology, April 1998.
  • Jennie S. Hwang, "Comparison of 63Sn & 62Sn - Part I", Surface Mount Technology, May 1998.
  • Jennie S. Hwang, "Further Comparison of 63Sn and 62Sn" Surface Mount Technology, June 1998.
  • Jennie S. Hwang, "Mass Reflow - Prelude", Surface Mount Technology, July 1998.
  • Jennie S. Hwang, "N2 Atmosphere Soldering - Passe or Future", Surface Mount Technology, August 1998.
  • Jennie S. Hwang, "BGA Rework Considerations". Surface Mount Technology, November 1998.
  • Jennie S. Hwang, "What Can We Expect in 1999 - Part I", Surface Mount Technology, December 1998.
  • Jennie S. Hwang, "What Else Can We Expect in 1999 - Part II", Surface Mount Technology, January 1999.
  • Jennie S. Hwang, "What Else Can We Expect in 1999 - Part III", Surface Mount Technology, February 1999.
  • Jennie S. Hwang, "Solder Materials an Overview" Surface Mount Technology, step-by-step, March 1999.
  • Jennie S. Hwang, "Engineering Education & Workforce", Surface Mount Technology, March 1999.
  • Jennie S. Hwang, "BGA & CSP - Solder Spheres", Surface Mount Technology, April, 1999.
  • Jennie S. Hwang, "Reflections from NEPCON West '99", Surface Mount Technology, May 1999.
  • Jennie S. Hwang, "Lead-Free Solders: Year 2000 & Beyond", Surface Mount Technology, July, 1999
  • Jennie S. Hwang, "Lead-Free Solders - Year 2000 & Beyond Part II -", Surface Mount Technology, August 1999.
  • Jennie S. Hwang, "Evolution of Surface Mount Manufacturing in Southern China", September 1999.
  • Jennie S. Hwang, "Promising Lead-Free Compositions ", Surface Mount Technology, October 1999.
  • Jennie S. Hwang, "Laser Soldering", Surface Mount Technology, November 1999.
  • Jennie S. Hwang, "Laser Soldering-A New Manufacturing System", Surface Mount Technology, December 1999.
  • Jennie S. Hwang, "Preparation for the New Millennium--Technology, Education, and the new Workforce", Surface Mount Technology, January , 2000
  • Jennie S. Hwang, "What Can We Expect in Year 2000-- Part I ", Surface Mount Technology, February 2000.
  • Jennie S. Hwang, "What Can We Expect in Year 2000-- Part II ", Surface Mount Technology, March 2000.
  • Jennie S. Hwang, "Pb, Ag, Bi, Sb-Free Solder System ", Surface Mount Technology, April 2000.
  • Jennie S. Hwang, "Leadership-Inside and Outside the Industry ", Surface Mount Technology, May 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Bi System", Surface Mount Technology, June 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder-- Sn/Ag/Cu System ", Surface Mount Technology, July 2000.
  • Jennie S. Hwang, "A strong Lead-Free Candidate -- Sn/Ag/Cu/Bi System ", Surface Mount Technology, August 2000.
  • Jennie S. Hwang, "Another strong Lead-Free Candidate -- Sn/Ag/Bi/In System ", Surface Mount Technology, September 2000.
  • Jennie S. Hwang, "A fatigue-resistant Lead-Free Candidate -- Sn/Ag/Cu/In System", Surface Mount Technology, October 2000.
  • Jennie S. Hwang, "Environment-friendly Lead-Free Solder - Sb effect in Sn/Ag", Surface Mount Technology, November 2000.
  • Jennie S. Hwang, "The Myth of Bi in Solders-Part I", Surface Mount Technology,December 2000.
  • Jennie S. Hwang, Holger Koenigsmann, "High Strength and High-Fatigue-Resistant Lead-free Solder", SMT, March 2000, Page 55.
  • Jennie S. Hwang , "Overview of Solder Materials, Step-by-Step", SMT, March, 2000, Page 81
  • Jennie S. Hwang and Z. Guo, " Effect of Bi Contamination on Sn/Pb Eutectic Solder", SMT, September 2000, Page 91.
  • Jennie S. Hwang, "Overview of Lead Free Solders", SMT, March 2001, Page 60.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 1", Chip Scale Review, December 2000.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 2", Chip Scale Review, January/February, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 3", Chip Scale Review, March/April, 2001
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 4", Chip Scale Review, May/June, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 5", Chip Scale Review, July/August, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 6", Chip Scale Review, September/October, 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 7", Chip Scale Review, November 2001.
  • Jennie S. Hwang and Z. Guo, " Effect of Pb Contamination on lead Free Solder-Part 8", Chip Scale Review, December 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 - Welcoming the Digital Economy", Surface Mount Technology, January 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 -- Semiconductors", Surface Mount Technology, February 2001.
  • Jennie S. Hwang, "Reflections from Apex 2001", Surface Mount Technology, March 2001.
  • Jennie S. Hwang, "Step-by-Step manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2001
  • Jennie S. Hwang, "What Can We Expect in 2001 - IC and Passive Packages", Surface Mount Technology, April 2001.
  • Jennie S. Hwang, "What Can We Expect in 2001 - Board level assembly", Surface Mount Technology, May 2001.
  • Jennie S. Hwang, H. Koenigsmann & Zhenfeng Guo, "A High-Performance Lead-free Material-the effect of In on 99.5Sn0.7Cu", Soldering & Surface Mount Technology, Great Britain, Vol. 13, Number 2, 2001, P. 7
  • Jennie S. Hwang, "Viable Lead-Free Compositions", Surface Mount Technology, June 2001.
  • Jennie S. Hwang, "Selection Criteria: Lead-Free Compositions", Surface Mount Technology, July, 2001
  • Jennie S. Hwang, "The Science and Applications of Bismuth", May 2001, Bismuth Institute, Brussels, Belgium
  • Jennie S. Hwang, "The Power of Silicon", SMT Magazine, PennWell Publications, LTD, September 2001
  • Jennie S. Hwang, "Overview of Soldering Joining for Electronics Industry", International Journal of Powder Metallurgy, October 2001
  • Jennie S. Hwang, "Passive Components-Technology and Market", SMT Magazine, PennWell Publications, LTD, December, 2001
  • Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 1", Surface Mount Technology, PennWell Publications, LTD, January 2002
  • Jennie S. Hwang, "What Can We Expect in 2002 in Electronics Industry-Part 2", Surface Mount Technology, PennWell Publications, LTD, March 2002
  • Jennie S. Hwang, "Step-by-Step Manufacturing-Soldering Materials", SMT Magazine, PennWell Publications, LTD, March 2002
  • Jennie S. Hwang, "What are the Top Two Parameters in Selecting a Lead-free Material?", SMT Magazine, PennWell Publications, LTD, June 2002
  • Jennie S. Hwang, "Lead-Free Symposium at APEX", SMT Magazine, PennWell Publications, LTD, April 2002
  • Jennie S. Hwang, "Anatomy of SnAgCu in SMT Applications", SMT Magazine, PennWell Publications, LTD, August, 2002
  • Jennie S. Hwang, ET. al., "Environment-friendly Lead-Free technology and Applications in Electronics and Microelectronics", June/July issue, The Journal of International Microelectronics and Packaging Society, 2002
  • Jennie S. Hwang, "What are Drop-in Lead-Free Alloys?", SMT Magazine, PennWell Publications, LTD, September, 2002
  • Jennie S. Hwang, "Microelectronics Conference in Brazil", SMT Magazine, PennWell Publications, LTD, November, 2002
  • Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 1", Surface Mount Technology, January 2003
  • Jennie S. Hwang, "What Can We Expect from the Electronics Industry in 2003-Part 2", Surface Mount Technology, March 2003
  • Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2003
  • Jennie S. Hwang, "Outsource or Not and to What Extent", Surface Mount Technology, April 2003
  • Jennie S. Hwang, "Comparative Wetting Ability of Lead-free Solder Alloys", Electronic Packaging and Production, April 2003
  • Jennie S. Hwang, "The Evolution of Environment-friendly Lead-free Electronics on International Landscape", Surface Mount Technology, June 2003
  • Jennie S. Hwang, "Revisiting Solder Paste", Surface Mount Technology, August 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Two Approaches", Surface Mount Technology, November 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Alloys for Two Approaches", Surface Mount Technology, December 2003
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-No Need for Higher Temperature", Surface Mount Technology, January 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Drop-in Implementation", Global Surface Mount Technology and Packaging, January-February Issue 2004 Great Britain
  • Jennie S. Hwang, "Environment-friendly Lead-Free Implementation-Critical Production Consideration", Surface Mount Technology, March 2004
  • Jennie S. Hwang, "Solder Materials-Step-by-Step", Surface Mount Technology, March 2004
  • Jennie S. Hwang, "Changing the Factory to Lead-Free", Surface Mount Technology, June 2004, Page 56
  • Jennie S. Hwang, "Dispel the Notions about Environment-friendly Lead-Free ", Surface Mount Technology, September 2004
  • Jennie S. Hwang, "The Electronics Manufacturing Industry in Asia", Surface Mount Technology, November 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Reliability", Surface Mount Technology, December 2004
  • Jennie S. Hwang, "Environment-friendly Lead-free Production Success Requires an Open Mind-Part 1", EMSNow.com. December 2004
  • Jennie S. Hwang, "Lead-free Banner Year", Surface Mount Technology, January 2005
  • Jennie S. Hwang, "Environment-friendly Electronics-Cost Consideration", Surface Mount Technology, March 2005
  • Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 1", Surface Mount Technology, June 2005
  • Jennie S. Hwang, "Bismuth in Pb-free System-Not to Fear, Part 2", Surface Mount Technology, August 2005
  • Jennie S. Hwang, "Cost of Ownership of Lead-free Assembly", Surface Mount Technology, November 2005
  • Jennie S. Hwang, Interview Article: "The Future Trends of Electronics Industry", OnBoard, Brussels, Belgium, November 2005.
  • Jennie S. Hwang, "The Electronics Industry Going Forward", Surface Mount Technology, January 2006.
  • Jennie S. Hwang, "Lead-free Electronics-Future, Today & Past", U.S. Tech, February, 2006
  • Contributing author: The Road to Scientific Success: Inspiring Life Stories of Prominent Researchers", World Scientific Publishing Company, PTE, Ltd., to be published 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 1", Surface Mount Technology, April, 2006.
  • Jennie S. Hwang, "Low Temperature Lead-free Production vs. SAC", OnBoard Technology, On Publishing SA, Brussels, Belgium, May, 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 2", Surface Mount Technology, July, 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 3", Surface Mount Technology, August 2006.
  • Jennie S. Hwang, " Materials ", Advancing Microelectronics - Special Edition, August 2006.
  • Jennie S. Hwang, "How to Test & Assess Lead-free Reliability - Part 4", Surface Mount Technology, December 2006.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 5", Surface Mount Technology, March 2007.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 6", Surface Mount Technology, May, 2007.
  • Jennie S. Hwang, "Reliability for Harsh Environment Electronics - Part 7", Surface Mount Technology, September 2007.
  • Interview: "Future and Emerging Technologies", Global SMT and Packaging, September 2007.